BRIDG is powering tomorrow’s breakthroughs thanks to a unique collaboration model activated within the only advanced manufacturing development facility focused on semiconductor-based processes and materials for smart sensor and photonic technologies.
Driven by the Internet of Things, advanced microelectronics are transforming human interaction with the world. From cars and homes to medical and personal fitness equipment, the growing demand for integrated devices requiring advanced technology is rapidly multiplying, powering a new era known as the Fourth Industrial Revolution. As this trend grows, new cutting-edge manufacturing processes are necessary to keep up with the pace of the microelectronics-driven economy. The technology in development at BRIDG is on track to be a disruptive force in virtually every industry value chain that delivers a product or service to anyone, anywhere.
Accelerate high potential technologies into next-generation products and systems
Develop and provide commercialization infrastructure (via BRIDG and partners)
Provide capability for proof of concept, custom development, and pilot production
Provide academic institutions with
infrastructureto enable them to conduct core research with a path to commercialization
Provide Digital Twin for Semiconductors
2.5 / 3D Device Integration, Test, and Packaging
Hardware and System Secure Devices and Processes such as PUF from ReRAM for cryptography
Advanced Materials and Device Development Lines – III-V and other novel materials integrated into silicon-based devices
– Sensors, Imagers, RF, Power, and other heterogeneous integrated devices
– Materials Focus – GaAs, InGaAs, InP, GaSb
Photonics, High Speed Electronic Systems, and Design Center (via
By uniting bold ideas with holistic capabilities, BRIDG enables tomorrow’s advanced innovations to reach the market at a greater velocity than ever before across a multitude of fields.
Our manufacturing development center is focused on two initial functional platforms:
Advanced Materials and Devices Development Line
- Designed to support a broad range of industries (Biomedical, Agriculture, Environmental, etc.
- Universal Smart Sensors and III-V materials – Multipurpose product applications (ionic, molecular, chemFETs sensor with wireless communication)
Advanced Packaging, Testing, and Device Integration Development Line
- Back-end processing and packaging line for prototype development and commercialization (Biomedical, Oil and Gas, Aerospace/Defense, Environmental, Agriculture Sensors)
- Advanced Optics and photonics devices – wide range of advanced applications (SIP)
BRIDG successfully completed installation of a core set of 200mm wafer-processing tools in summer 2018 to enable researchers and electronics product companies to develop and produce
BRIDG capabilities will be focused around these initial process technologies:
Advanced System Integration—Includes heterogeneous 2.5D and 3D chip integration using techniques for system-in-package, wafer-level fan-out, and die-level stacking.
BRIDG’s current photolithography capabilities allow building chip features as small as 0.5 micron, which enables ultra-dense metal
ReRAM Process Technologies—Enables a very unique, Physically Unclonable Function (PUF) capability, positioned to be a key security root-of-trust for next-generation systems by enabling more robust cryptography and chip-level “fingerprinting.”
ReRAM Process Technologies
Among the first chip process technologies that BRIDG is concentrating on is a Resistive Random-Access-Memory (ReRAM) process. The ReRAM process enables the creation of an array of unique PUF (physically unclonable functions) or information cells from resistive elements instead of transistor-based memory bits.
III-V and GaN Technologies—Enables the production of wafers with special crystalline materials “grown” on top of a wafer from the III and V groupings on the periodic table of elements, such as gallium arsenide (GaAs), indium phosphide (InP) and indium gallium arsenide (InGaAs), and are useful for creating functions like lasers, photocouplers, radio-frequency devices and many types of sensors and other devices.
III-V and GaN Technologies
BRIDG enables open innovation platforms using advanced materials and device development lines, which can accelerate the commercialization of new sensors and other technologies. BRIDG’s technology initiatives in III-V deposition tools and other materials pave the way for sensors, photonics, optics and advanced integrated devices to support diverse industries, including biomedical, agriculture, environmental, and RF communications. BRIDG will initially offer epitaxial growth of III-V materials such as GaAs and InP on 150mm and smaller wafers. Over time, BRIDG will also offer lithographic device processing capabilities on these smaller wafers. BRIDG also has an initiative in process to provide GaN epitaxial growth and device processing on 200mm wafers, which would make BRIDG one of very few places in the world with open GaN foundry capabilities of growth and processing under one roof.
Leading-Edge Technology Development—Provides access to BRIDG’s arsenal of semiconductor processing tools for photolithography, deposition, etching, doping, cleaning, metrology and testing. These numerous and diverse tools for chip production are the production backbone of the semiconductor industry and are each very complex machines by themselves.
Leading-Edge Technology Development
BRIDG plans to acquire additional tools over the next several years ensuring it to be more advantageous and attractive for manufacturers from health, aerospace, defense and other industries. While a solid set of the core tools at BRIDG are now installed and qualified for use, the list of additional tools being planned and considered for future technology platform growth is long. The expansion capabilities for BRIDG have been planned from the beginning to be significant and flexible.