Advanced System Integration & Packaging

Advanced System Integration & Packaging

BRIDG provides credible and reliable domestic advanced microelectronics manufacturing capability accessible to the defense industrial base.


BRIDG capabilities are centered on an advanced system integration platform, which enables the high-density integration of multi-chip systems. Advanced system integration provides solutions for size, weight and power reduction to address functional density scaling challenges.

Improved Performance

  • Heterogeneous chip integration (Si, III/V, Photonics)
  • Ultra-high density (1,000,000+ I/O)
  • Power consumption and system response time
  • Robust operating temperature range (77K to 673K)

Improved Form Factor

  • Transforms traditional IoT sensor techniques enabling improved monitoring with more capabilities at the “edge”
  • Enables system miniaturization

Learn more about advanced system integration and packaging.

Related content

A Path to More Than Moore

Advanced system integration technology offers the most affordable path to ensuring Moore’s law — the long-running trend of the number of transistors on a chip doubling every two years while the costs are halved — continues as we move into the future