Advanced System Integration & Packaging
BRIDG expands domestic access to leading-edge process capability.
With unique partnerships in place with the semiconductor supply chain, BRIDG drives 200mm processing technology to the next level.
Together with industry leaders, BRIDG fuels microelectronics innovation and ensures a U.S. technological edge in semiconductor materials, process technology, architectures, designs, and applications.
Learn more about process technology R&D.
SUSS MicroTec and BRIDG to Establish a Production-Level Applications Center in North America
With SUSS MicroTec tools onsite at BRIDG, this collaboration adds capabilities that enable customers to design systems at the cutting edge of performance.
TEL and BRIDG: Next Generation Process, Tool, and Device Development Partnership
Technology development and the execution and demonstration of new technologies and tools will drive 200mm processing technology to the next level.