We are a U.S.-based not-for-profit, public-private partnership providing R&D expertise and a versatile 200mm microelectronics fabrication facility serviceable to multi-industry sectors. We focus on the development and evolution of digital, RF, and photonics interposer technology coupled with packaging capabilities to serve as the advanced packaging hub for semiconductors.

BRIDG unites ideas with industry to accelerate the manufacturing development of emerging technologies and spark tomorrow’s innovations.

BRIDG offers industry solutions for next-generation nanoscale production.

Tour our facility in this short introduction video.

Powerful partners unite to advance a future-focused center of innovation led by an ethos of collaboration.