Critical Dimension Scanning Electron Microscope for measuring lines and spaces at a sub-micron level using a focused electron beam.
The Asher is used for stripping resist from silicon wafers for cleaning purposes. This process uses an oxygen plasma to remove the organic material.
Furnaces (Anneal, Oxide, Nitride, Poly, Diffusion)
Furnace annealing is a process used in semiconductor device fabrication which consist of heating multiple semiconductor wafers in order to affect their electrical properties.
CVD (SiN, SiO2)
Plasma enhanced chemical vapor deposition for high quality silicon oxide, silicon nitride, TEOS and other films.
CVD – HDP
High Density Plasma Chemical Vapor Deposition produces higher plasma density for improved film qualities.
Single Wafer Wet Processing (Electroplating, Liftoff, Solvent Strip and Acid Clean)
The single wafer modular system that has modules for spray solvent, spray acid and electroplating.
Complete List of Equipment Acquisitions
- Bond Aligner/Mask Aligner
- Bond Alignment Metrology
- Bonder, Permanent
- CMP (Cu)
- CMP (Oxide/W)
- Coater / Developer
- CVD (W)
- Deep Silicon Etch and Wafer Plasma Dicing
- Defect Inspection – Bright Field
- Ellipsometer, Film Thickness, Stress Measure
- Etch Metal Etch
- Etch Oxide Etch
- Etch Poly Etch
- Evaporator (Au, Pt, Ti, Al, etc.)
- Ion Implant (Medium Current)
- Photoluminence/Defect Measure/li>
- PVD (Chambers: Cu, TaN, Al, TiN, RPC)
- Wafer Scrubber
- Wet Bench (Acid, Base)
- XRD, XRR, XRT
- 4-Point Probe
Atomic Layer Deposition – ALD Tool
Fine Line Lithography – 193nm / e-beam
High Alignment Accuracy Pick and Place Tool
Metal Oxide Chemical Vapor Deposition – MOCVD Tool
Molecular Beam Epitaxy – MBE
Transmission Electron Microscope – TEM
Complete List of Future Equipment
- Batch Solvent Hood
- Hall Measurement Tool
- Materials Coater
- SEM with FIB
- Tape and Frame
- Temporary Bonder
- Wafer Grinder