Kissimmee, Fla. and Huntsville, Ala. – BRIDG announced today that it has been awarded a contract by Radiance Technologies, Inc. (Radiance) to develop advanced semiconductor packaging technologies. The three-year agreement has a contract ceiling of $28 million.
The partnership expands the existing collaboration between the two organizations and represents the first of many anticipated projects focused on BRIDG’s heterogeneous integration technology platforms.
“Radiance is pleased to build on our existing relationship with BRIDG by leveraging their digital and analog silicon interposer lines to build state of the art, high mix, low volume microelectronics for the DoD. BRIDG is filling a critical gap in the US microelectronics ecosystem with their advanced system integration and packaging capabilities.” said Dr. Robert Overbeek, Vice President, Radiance Technologies.
Based in Central Florida at NeoCity – an emerging five hundred-acre technology greenfield – BRIDG operates a state-of-the-art 200mm microelectronics fabrication facility delivering solutions to industry and government partners through collaborative technology development and secure manufacturing programs.
“This partnership builds upon prior strategic investments at BRIDG and supports our broader mission to establish a credible and reliable domestic capability for semiconductor R&D and production accessible to the industrial base,” said BRIDG Interim CEO Brian Sapp. “Together with Radiance and other partners, this establishes BRIDG as an industry leader in strengthening our domestic semiconductor supply chain.”
Radiance joins a growing list of BRIDG partners that are led by founding visionary stakeholders Osceola County, the University of Central Florida, Florida High Tech Corridor Council, and the State of Florida. Additional partners include L3Harris Technologies, Siemens, Massey Services, Tokyo Electron, SUSS MicroTec, and others.
About Radiance Technologies, Inc.
Radiance Technologies is a 100% employee-owned small business prime contractor founded in 1999. Radiance has over 900 employee-owners across the United States serving the Department of Defense, national intelligence community and other government agencies. From concepts to capabilities, Radiance leads the way in developing customer-focused solutions in the areas of cyber security, systems engineering, prototyping and integration as well as operational and strategic intelligence including scientific and technical intelligence. Radiance leverages small business flexibility and large business innovation to provide technical support, solutions, and products, as well as the benefits of diverse technical competencies along with flexibility and responsiveness. They now have corporate facilities in nine states and project offices across 12 states.
More information about the company available at: www.radiancetech.com
BRIDG is not-for-profit public-private partnership providing semiconductor R&D and production capabilities to industry and government, enabled by a versatile 200mm microelectronics fabrication facility. As the anchor tenant of an emerging 500-acre technology district known as NeoCity, BRIDG operates the fab with a focus on heterogeneous integration and advanced packaging process technologies, and the development of a secure manufacturing methodology leveraging digital twin and other Industry 4.0 concepts. Supported by Osceola County, University of Central Florida, Florida High Tech Corridor Council and others, BRIDG connects challenges and opportunities with solutions; “Bridging the Innovation Development Gap” making commercialization possible.
Learn more at www.GoBRIDG.com.
Emmett Moore, Corporate Communications Manager, Radiance Technologies
Jenna Bainter, Marketing and Community Relations, BRIDG