BRIDG provides credible and reliable domestic advanced microelectronics manufacturing capability accessible to the defense industrial base.
BRIDG capabilities are centered on an advanced system integration platform, which enables the high-density integration of multi-chip systems. Advanced system integration provides solutions for size, weight and power reduction to address functional density scaling challenges.
Improved Performance
- Heterogeneous chip integration (Si, III/V, Photonics)
- Ultra-high density (1,000,000+ I/O)
- Power consumption and system response time
- Robust operating temperature range (77K to 673K)
Improved Form Factor
- Transforms traditional IoT sensor techniques enabling improved monitoring with more capabilities at the “edge”
- Enables system miniaturization