Dr. John Allgair
2.5D / 3D Program Manager
Dr. John Allgair leads the Advanced Packaging Integration program which is focused on providing robust, cost-effective platforms for the heterogeneous integration of silicon, III/V and photonic devices to enable smart sensor integration.
Over his twenty-year career in the semiconductor industry, Dr. Allgair has worked in roles focused on business growth, innovation and bringing new products to market during tenures at Nanometrics, GLOBALFOUNDRIES, AMD, SEMATECH, Freescale, and Motorola. His semiconductor engineering background includes advanced packaging integration, factory design, process integration, yield enhancement, lithography, and materials characterization.
Dr. Allgair serves on the SPIE Advanced Lithography program committee and has multiple publications in peer-reviewed, industry journals. He received a Ph.D. in electrical engineering with an emphasis in semiconductor physics and processing from Arizona State University.