BRIDG is powering tomorrow’s breakthroughs thanks to a unique collaboration model activated within the only advanced manufacturing development facility focused on semiconductor-based processes and materials for smart sensor and photonic technologies.

BRIDG is powering tomorrow’s breakthroughs thanks to a unique collaboration model activated within the only advanced manufacturing development facility focused on semiconductor-based processes and materials for smart sensor and photonic technologies.

BRIDG Solutions

  • Accelerate high potential technologies into next generation products and systems
  • BRIDG and partners develop and provide commercialization infrastructure
  • Provide capability for proof of concept, custom development, and pilot production
  • IP Protection
  • Provide academic institutions with infrastructure to enable them to conduct core research

BRIDG Technology Development Platforms

  • Photonics, High Speed Electronic Systems, and Design Center
  • Advanced Materials and Device Development Lines – III-V and other novel materials integrated into silicon-based devices (CMOS, ASIC, and other Advanced Devices)
    – Sensors, Imagers, RF, Power, and other monolithically integrated devices
    – Materials Focus – GaAs, InGaAs, InP, GaSb, GaN, InGaN, AlGaN
  • 2.5 / 3D Device Integration, Test, and Packaging

Market Focus

  • Aerospace, Defense, and Homeland Security
  • Environmental, Food, and Agriculture
  • Robotics, Autonomous Systems, Manufacturing, and Energy
  • Advanced Device Hardware and Software Integration – IoT / Cybersecurity / Smart Communities / Entertainment
  • Biomedical
uniting

By uniting bold ideas with holistic capabilities, BRIDG enables tomorrow’s advanced innovations to reach the market at a greater velocity than ever before across a multitude of fields.

Our manufacturing development center is focused on two initial functional platforms:

Advanced Materials and Devices Development Line
  • Designed to support a broad range of industries (Biomedical, Agriculture, Environmental, etc.)
  • GaN and InGas MOCVD deposition tools – utilizing 8″ silicon substrates
  • Universal Smart Sensors and III-V materials – Multipurpose product applications (ionic, molecular, chemFETs sensor with wireless communication)
Advanced Packaging, Testing, and Device Integration Development Line
  • Back-end processing and packaging line for prototype development and commercialization (Biomedical, Oil and Gas, Aerospace/Defense, Environmental, Agriculture Sensors)
  • Advanced Optics and photonics devices – wide range of advanced applications (SIP)