BRIDG’s tool set accommodates both 150mm and 200mm wafer sizes and supports processes such as diffusion/oxidation, thin film deposition (dielectrics and metals), plasma etching, wet cleans & etchings, implantation, lithography, wafer bonding, electroplating, and metrology. Future tools will support ALD and GaN and III-V epi growth.

BRIDG’s tool set accommodates both 150mm and 200mm wafer sizes and supports processes such as diffusion/oxidation, thin film deposition (dielectrics and metals), plasma etching, wet cleans & etchings, implantation, lithography, wafer bonding, electroplating, and metrology. Future tools will support ALD and GaN and III-V epi growth.

Equipment Acquisitions

CD SEM – SEM5 Hitachi 9200

Critical Dimension Scanning Electron Microscope for measuring lines and spaces at a sub-micron level using a focused electron beam.

Asher – Trion Apollo III

The Asher is used for stripping resist from silicon wafers for cleaning purposes. This process uses an oxygen plasma to remove the organic material.

Furnaces – Tel Alpha 8s (Anneal, Oxide, Nitride, Poly, Diffusion)

Furnace annealing is a process used in semiconductor device fabrication which consist of heating multiple semiconductor wafers in order to affect their electrical properties.

CVD – Novellus C2 Sequel (SiN, SiO2)

Plasma enhanced chemical vapor deposition for high quality silicon oxide, silicon nitride, TEOS and other films.

CVD – HDP – AMAT Centura

High Density Plasma Chemical Vapor Deposition produces higher plasma density for improved film qualities.

Single Wafer Wet Processing – SEMSYSCO Triton (Electroplating, Liftoff, Solvent Strip and Acid Clean)

The Triton is single wafer modular system that has modules for spray solvent, spray acid and electroplating.

Complete List of Equipment Acquisitions
  • Bond Aligner/Mask Aligner – SUSS MABA8 Gen4Pro
  • Bond Alignment Metrology – SUSS DSM8/200 Gen2
  • Bonder, Permanent – SUSS XB8
  • CMP – AMAT Mirra Trak (Cu)
  • CMP – AMAT Mirra Trak (Oxide/W)
  • Coat / Dev – TEL ACT8
  • CVD – AMAT Centura (W)
  • Deep Silicon Etch and Wafer Plasma Dicing – SPTS Rapier
  • Defect Inspection – KLA 2139 – Bright Field
  • Ellipsometer, Film Thickness, Stress Measure – KLA F5x
  • Etch – AMAT CENTURA Metal Etch
  • Etch – AMAT CENTURA Oxide Etch
  • Etch – AMAT CENTURA Poly Etch
  • Evaporator – UEFC-4900 Temescal (Au, Pt, Ti, Al, etc.)
  • Goniometer – Rame-Hart
  • Ion Implant – Varian E500 (Medium Current)
  • Overlay – Inspectrology
  • Photoluminence/Defect Measure – KLA Cadela CS920
  • PVD – AMAT Endura (Chambers: Cu, TaN, Al, TiN, RPC)
  • Stepper – Nikon i-Line – i12
  • Wafer Scrubber – DSS2 OnTrak
  • Wet Bench – JST (Acid, Base)
  • XRD, XRR, XRT – Panalytical X’PERT3MRD
  • 4-Point Probe – CDE

Future Equipment

Atomic Layer Deposition – ALD Tool
Fine Line Lithography – 193nm / e-beam
High Alignment Accuracy Pick and Place Tool
Metal Oxide Chemical Vapor Deposition – MOCVD Tool
Molecular Beam Epitaxy – MBE
Transmission Electron Microscope – TEM
Complete List of Future Equipment
  • AFM
  • Batch Solvent Hood
  • De-Bonder
  • Hall Measurement Tool
  • Materials Coater
  • Microscope
  • Profiler
  • RTP
  • SAM
  • SEM with FIB
  • Tape and Frame
  • Temporary Bonder
  • Wafer Grinder