BRIDG’s tool set accommodates both 150mm and 200mm wafer sizes and supports processes such as diffusion/oxidation, thin film deposition (dielectrics and metals), plasma etching, wet cleans & etchings, implantation, lithography, wafer bonding, electroplating, and metrology. Future tools will support ALD and III-V epitaxial growth.

BRIDG’s tool set accommodates both 150mm and 200mm wafer sizes and supports processes such as diffusion/oxidation, thin film deposition (dielectrics and metals), plasma etching, wet cleans & etchings, implantation, lithography, wafer bonding, electroplating, and metrology. Future tools will support ALD and III-V epitaxial growth.

Tools / Equipment List

CD SEM
Critical Dimension Scanning Electron Microscope for measuring lines and spaces at a sub-micron level using a focused electron beam.
Asher
The Asher is used for stripping resist from silicon wafers for cleaning purposes. This process uses an oxygen plasma to remove the organic material.
Furnaces (Anneal, Oxide, Nitride, Poly, Diffusion)
Furnace annealing is a process used in semiconductor device fabrication which consist of heating multiple semiconductor wafers in order to affect their electrical properties.
CVD (SiN, SiO2)
Plasma enhanced chemical vapor deposition for high quality silicon oxide, silicon nitride, TEOS and other films.
CVD – HDP
High Density Plasma Chemical Vapor Deposition produces higher plasma density for improved film qualities.
Single Wafer Wet Processing (Electroplating, Liftoff, Solvent Strip and Acid Clean)
The single wafer modular system that has modules for spray solvent, spray acid and electroplating.
Complete List of Equipment
  • Asher
  • Automated Permanent Bonder
  • Automated Photoresist Coater / Developer / Baker
  • Batch Solvent Hood
  • Bond Aligner/Mask Aligner
  • Bond Alignment Metrology
  • Bonder, Permanent
  • Box Washer
  • CD SEM
  • CMP (Cu)
  • CMP (Oxide/W)
  • Coater / Developer
  • CVD HDP
  • CVD (SiN, SiO2)
  • CVD (W)
  • Deep Silicon Etch and Wafer Plasma Dicing
  • Defect Inspection – Bright Field
  • Digital Microscope
  • Ellipsometer, Film Thickness, Stress Measure
  • Etch Metal Etch
  • Etch Oxide Etch
  • Etch Poly Etch
  • Evaporator (Au, Pt, Ti, Al, Ni, etc.)
  • Furnaces (Anneal, Oxide, Nitride, Poly, Diffusion)
  • Goniometer
  • Ion Implant (Medium Current)
  • Laser Scribe
  • Manual Wafer Cleaner (With Tape Protection)
  • Manual Excimer Laser De-Bonder
  • Manual Wafer De-Bonder
  • MOCVD (III/V)
  • Overlay
  • Photoluminescence/Defect Measure
  • Print Transfer
  • Profiler
  • PVD (Chambers: Cu, TaN, Al, TiN, RPC)
  • RTA
  • SEM with FIB
  • Single Wafer Wet Processing (Electroplating, Liftoff, Solvent Strip and Acid Clean)
  • Stepper
  • Wafer Scrubber
  • Wet Bench (Acid, Base)
  • Wet Bench (Solvent)
  • XRD, XRR, XRT
  • 4-Point Probe

Future Equipment

Atomic Layer Deposition – ALD Tool
Fine Line Lithography – 193nm / e-beam
High Alignment Accuracy Pick and Place Tool
Metal Oxide Chemical Vapor Deposition – MOCVD (GaN)
Molecular Beam Epitaxy – MBE
Transmission Electron Microscope – TEM
Complete List of Future Equipment
  • AFM
  • Atomic Layer Deposition (ALD)
  • Fine Line Lithography – 193nm / e-beam
  • Hall Measurement Tool
  • High Alignment Accuracy Pick and Place
    • Materials Coater
    • Metal Oxide Chemical Vapor Deposition – MOCVD (GaN)
    • Molecular Beam Epitaxy (MBE)
    • Tape and Frame
  • Temporary Bonder
  • Transmission Electron Microscope (TEM)
  • Vector Network Analyzer
  • Wafer Grinder